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ANDROID MOBILE PHONE BASIC TO ADVANCED CHIP LEVEL SERVICE TRAINING

DURATION : 40 HOURS TOTAL / FEES JUST RS.9999/-

Our Mobile Repair Training offers in-depth knowledge of hardware and software repairs, including eMMC/UFS UFI & F64 BOX FLASHING techniques. Emmc, Power ic and CPU reballing techniques.
Get hands-on chip-level troubleshooting training using modern hardware diagnostic tools.
Learn professional Borneo schematic reading to trace and fix complex logic board faults.
Boost your repair shop revenue or launch a certified technician career today. Students will gain hands-on experience with real devices, ensuring they master the skills required for successful careers in mobile technology repair.

PC & LAPTOP BASIC TO CHIP LEVEL SERVICE TRAINING

DURATION : 40 HOURS TOTAL , FEES JUST RS.9999/-

Get expert PC and laptop service training from basic assembling & software troubleshooting to advanced chip-level motherboard repair. Master the art of computer hardware repair with our comprehensive PC and laptop basic to chip-level training program. Designed for beginners and professionals, this course covers everything from simple troubleshooting to advanced motherboard circuitry, IC fault finding. Our expert instructors provide 100% practical, hands-on training with advanced diagnostic tools, schematic diagrams, and live laptop boards. Learn the secrets of repairing dead laptops, water-damaged motherboards, and complex power section faults. We provide lifetime technical support to help you start your own business or secure a high-paying job. Join Chennai’s top-rated hardware institute and turn your technical passion into a successful, future-proof career.

MOBILE PHONE BASIC TO CHIP LEVEL SERVICE TRAINING SYLLABUS

This 20-day intensive syllabus is designed to transition students from basic electronics to advanced chip-level diagnostics. It balances theoretical knowledge with intensive hands-on practice.

Phase 1: Foundations (Days 1–5)

Focus: Electronics fundamentals and basic hardware repair.

• Day 1: Introduction to mobile architecture, safety protocols (ESD), and workspace setup.
• Day 2: Fundamentals of electricity: Voltage, current, resistance. Using digital multimeters.
• Day 3: Electronic components: Resistors, capacitors, diodes, transistors, and inductors (Identification and testing).
• Day 4: Mobile phone disassembly/reassembly (diverse models). Handling screens, batteries, and flex cables.
• Day 5: Replacement of basic modules: Charging ports, microphones, speakers, and volume/power buttons.

Phase 2: Intermediate Hardware & Software (Days 6–10)

Focus: Diagnostic techniques and entry-level software.

• Day 6: Advanced soldering: Using soldering stations, hot air rework stations, and flux for delicate repairs.
• Day 7: Troubleshooting dead phones using DC power supply (current draw analysis).
• Day 8: Introduction to software: Flashing, factory resets, and clearing FRP (Factory Reset Protection).
• Day 9: Firmware updates, custom ROMs, and identifying software vs. hardware glitches.
• Day 10: Water damage repair: Ultrasonic cleaning, corrosion removal, and drying techniques.

Phase 3: Advanced Chip-Level Repair (Days 11–15)

Focus: PCB troubleshooting and integrated circuit (IC) work.

• Day 11: Reading circuit diagrams and schematics (using tools like Borneo or ZXW).
• Day 12: PCB architecture: Identifying Power IC, Charging IC, Network IC, and Audio IC.
• Day 13: Advanced soldering: Micro-soldering, jumper wire techniques, and track repair.
• Day 14: IC reballing: Removing, cleaning, and replacing BGA chips using stencils.
• Day 15: Troubleshooting power rails (VPH, VBATT) and short-circuit detection.

Phase 4: Professional Mastery & Specialization (Days 16–20)

Focus: Advanced diagnostics and business operations.

• Day 16: Advanced network troubleshooting: RF circuit analysis, antenna issues, and IMEI repair.
• Day 17: Display technology: OLED/AMOLED repair, glass-only replacement, and touch panel calibration.
• Day 18: Advanced CPU/Memory (eMMC/UFS) basics and advanced diagnostic case studies.
• Day 19: Customer management: Professional communication, service billing, and inventory tracking.
• Day 20: Final practical assessment, troubleshooting challenge, and business setup guidance.

PC & LAPTOP BASIC TO ADVANCED CHIP LEVEL SERVICE TRAINING SYLLABUS

This 20-day intensive syllabus for PC and Laptop chip-level repair is structured to move from foundational assembly to advanced signal-level troubleshooting. As requested, BGA reballing is excluded, focusing instead on deep-level circuit tracing and component-level repairs.

Phase 1: Foundations & Hardware Assembly (Days 1–5)

Focus: Disassembly, components, and standard repairs.

• Day 1: Introduction to PC/Laptop architecture, ESD safety, and tool mastery (soldering iron, tweezers, flux, multimeter).
• Day 2: PC and Laptop assembly/disassembly (diverse models), keyboard/touchpad replacement, and cooling system maintenance.
• Day 3: Basic Electronics: Resistors, capacitors, diodes, transistors, and MOSFETs (theory, identification, and “Cold” testing with a multimeter).
• Day 4: Laptop/PC Screen Technology: Replacing panels, troubleshooting flex cables, and inverter/backlight basics.
• Day 5: Software Fundamentals: BIOS/UEFI settings, OS installation (Windows/Linux), driver management, and data backup techniques.

Phase 2: Motherboard & Circuit Fundamentals (Days 6–10)

Focus: Power rails and schematic reading.

• Day 6: Motherboard Block Diagrams: Identifying power stages (19V, 3.3V, 5V, 1.8V, 1.2V, 1.05V).
• Day 7: Reading Schematics & Boardviews: Using tools like OpenBoardView, ZXW, or PDF schematics to trace circuit paths.
• Day 8: Power Sequence Analysis: Step-by-step logic of how a motherboard triggers from “DC-IN” to “Display.”
• Day 9: SMD Soldering & Rework: Precision removal/fixing of resistors, capacitors, and non-BGA ICs using hot-air stations.
• Day 10: Short Circuit Diagnosis: Identifying and injecting voltage to find shorted components (Capacitor/MOSFET shorts).

Phase 3: Advanced Tracing & Signaling (Days 11–15)

Focus: Deep-level signal diagnostics.

• Day 11: DSO Signal Tracing (Part I): Using an oscilloscope to check Crystal Oscillators (32.768kHz) and clock signals.
• Day 12: DSO Signal Tracing (Part II): Checking “Power Good” (PWRGD) signals and Reset signals (LPC_RST).
• Day 13: BIOS Programming: Using SPI programmers (e.g., RT809H/F) to read, verify, and write BIOS chips.
• Day 14: Multi-IO (Super I/O) Diagnostics: Tracing communication between the EC/KBC chip, BIOS, and the PCH/CPU.
• Day 15: Laptop Charging/Battery Circuits: Tracing charger IC pins (ACIN, ACOK, REGN) and battery communication protocols.

Phase 4: Professional Troubleshooting & Mastery (Days 16–20)

Focus: Complex faults and business application.

• Day 16: No-Power Logic: Troubleshooting dead boards with 0 current draw vs. high current draw.
• Day 17: No-Display Logic: Analyzing RAM voltage rails, VCC_CORE, and GPU power signals.
• Day 18: Liquid Damage & Trace Repair: Cleaning procedures and manual jumper wire techniques for broken PCB tracks.
• Day 19: Advanced Case Studies: Solving “Auto-restart,” “Fan Error,” and “Random Shutdown” issues using data-driven diagnostics.
• Day 20: Final Assessment: Practical troubleshooting challenge, testing against time-sensitive faults, and professional workshop management.

Recommended Toolkit for Your Institute

• Diagnostics: Digital Storage Oscilloscope (DSO), Digital Multimeter (true RMS), DC Power Supply (with current display).
• Soldering: Temperature-controlled Soldering Station, Hot Air Rework Station (SMD), Micro-soldering microscope.
• Programming: SPI BIOS Programmer (e.g., RT809H or SVOD).
• Documentation: open-source schematic and PDF FREE